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解决打包的问题。

This commit is contained in:
chenxudong 2024-11-27 10:04:51 +08:00
parent 9709d6a691
commit 92699d253d
2 changed files with 2 additions and 1 deletions
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1
pom.xml
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@ -255,6 +255,7 @@
</dependencyManagement> </dependencyManagement>
<build> <build>
<finalName>electromagnetic</finalName>
<plugins> <plugins>
<plugin> <plugin>
<groupId>org.springframework.boot</groupId> <groupId>org.springframework.boot</groupId>

2
service/src/main/java/com/electromagnetic/industry/software/data/manage/service/facade/EDDataFacadeImpl.java
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@ -1,4 +1,4 @@
package com.electromagnetic.industry.software.data.manage.service.facade; package com.electromagnetic.industry.software.data.manage.service.facade;
import cn.hutool.core.io.FileUtil; import cn.hutool.core.io.FileUtil;
import cn.hutool.core.io.IoUtil; import cn.hutool.core.io.IoUtil;